Apple has delayed the use of resin-coated copper components for a thinner logic board in iPhone once again, according to a new report.
Don’t Expect a Thinner iPhone this Year, or the Next One, as Apple isn’t Planning to Use Resin-Coated Copper Components
Once upon a time, Apple decided to use resin-coated copper components in the iPhone 16 . This would allow for the logic board to become thinner, saving a ton of internal space. However, that plan was delayed and it was expected the iPhone 17 would use those components.
According to Ming-Chi Kuo, that’s not happening with the iPhone 17 either as the supplier Apple is relying on for the components has failed to meet standards. This means these components aren’t going to be a part of the iPhone 17 either.
Now, a space saving design can lead to a lot of possibilities. For example, this would allow Apple to make a thinner iPhone. At the same time, Apple can, and it may not either, put a larger battery inside the upcoming iPhone. In fact, the extra space can be utilized in many different ways and we can only speculate.
Given how Apple is focusing on creating thinner everything, starting with the M4 iPad Pro, it’s safe to assume, at this point at least, Apple wants to create thinner hardware going forward without adding anything extra, But personally, I would prefer a slightly chunky iPhone or iPad in exchange for a larger battery. A thinner design does have that wow factor to it, but do we really need it? Given how much we use our devices these days, a bigger battery will definitely come in handy instead.
